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Heterogenous integration in microelectronics requires advanced materials.
September 14, 2022
By: DAVID SAVASTANO
Editor, Ink World Magazine
Brewer Science, Inc. will present new developments in temporary and permanent bonding material technologies for advanced packaging at SEMICON Taiwan, an international event connecting supply chain partners across the semiconductor industry. Dr. Alvin Lee, regional director at Brewer Science, has more than a decade of diverse experience in the semiconductor industry developing global partnerships to improve next-generation advanced packaging materials. Dr. Lee is a featured speaker at the SEMI...
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